UniSCool

Startup Competition
We are redefining the limits of high-performance electronics by solving the critical challenge of overheating in an era of rapid AI and data expansion. Our mission is to provide advanced thermal management that allows technology to run faster and longer without the massive energy footprint typically associated with cooling. By integrating cooling directly where the heat is generated, we ensure that the most demanding hardware can operate at peak performance while drastically reducing environmental impact. Our solutions are designed for industry leaders and innovators in High-Performance Computing (HPC), AI development, and semiconductor manufacturing, as well as pioneers in the electric vehicle and eMobility sectors. Whether managing massive data centers or optimizing power electronics for the next generation of transportation, we provide the infrastructure necessary to scale high-density workloads safely and efficiently. What sets us apart is our patented self-adaptive technology, which reduces cooling energy consumption by up to 50% compared to traditional methods. Our plug-and-play systems offer unmatched heat extraction capacity, maintaining uniform temperatures even under extreme thermal loads of up to 2000W. By choosing our technology, partners gain a scalable, future-proof thermal strategy that enhances hardware lifespan and drives significant operational savings.